Thermoelectric Separation Copper Substrate Prototyping, Thermoelectric Separation Substrate Prototype

Thermoelectric Separation Copper Substrate Prototyping, Thermoelectric Separation Substrate Prototype

We accept software formats: PADS, DXP, PROTEL 99SE, CAM350 (GERBER) supports CAD formats.
We supply 1~5 pcs Prototype samples only, The price are including freight shipped by USPS registed air mail post. From China to U.S. take about 15 days. If hope shipped by FEDEX express post, Please pay extra cost US$30

Thermoelectric separation substrate is a specialized type of substrate used in electronic devices to enhance heat dissipation. It consists of two distinct layers: the circuit layer and the thermal layer, which are positioned on different circuit layers.

What is the difference between thermoelectric separation copper substrate and ordinary aluminum substrate and copper substrate?
For users, the most intuitive difference is the parameters and scope of application:
The thermal conductivity of ordinary aluminum substrate/copper substrate is 1-2W, which is generally single digits, which is more suitable for low-power home appliance LEDs;
The thermal conductivity of the thermoelectrically separated copper substrate is about 400W, which is suitable for high-power, non-ordinary aluminum substrates that can be solved, such as LED lamp beads for automobiles.

For low-power lamp beads of about 1W, aluminum substrates are generally sufficient, and copper substrates are not required. Copper substrates are more suitable for high-power products, such as car lights with tens of watts or even hundreds of watts. In order to better meet everyone's needs, we must come up with higher quality and diversified products.
The thermal conductivity of copper is about 400W, and the “thermoelectric separation” process can better exert the heat dissipation characteristics of copper, so we started prototyping the thermoelectric separation copper substrate.